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Future 315 Low Residue No Clean Flux
The Future 315 No Clean Flux is a 2% solid colophony free and halide free flux. Not only does the Future 315 improve soldering performance but also reduces costs and there is no cleaning necessary after.
The No Clean Flux offers excellent solderability with a minimal level of flux residue. Future 315 is suitable for conventional, mixed and surface mount technology.
- Preheat : A topside temperature of between 80°C and 110°C is recommended.
- Solder Temperature: A solder temperature between 230°C and 250°C
Pricing Options
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Product Specifications
| Specification | 845-280 | 845-281 |
|---|---|---|
|
Size
|
125ml | 0.5L |